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FPC HDI 50um Laser Direct Imaging Equipment 610x710mm

Jiangsu GIS Laser Technologies Inc.,
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    Buy cheap FPC HDI 50um Laser Direct Imaging Equipment 610x710mm from wholesalers
     
    Buy cheap FPC HDI 50um Laser Direct Imaging Equipment 610x710mm from wholesalers
    • Buy cheap FPC HDI 50um Laser Direct Imaging Equipment 610x710mm from wholesalers
    • Buy cheap FPC HDI 50um Laser Direct Imaging Equipment 610x710mm from wholesalers
    • Buy cheap FPC HDI 50um Laser Direct Imaging Equipment 610x710mm from wholesalers
    • Buy cheap FPC HDI 50um Laser Direct Imaging Equipment 610x710mm from wholesalers

    FPC HDI 50um Laser Direct Imaging Equipment 610x710mm

    Ask Lasest Price
    Brand Name : GIS
    Model Number : DPX630SM
    Certification : ISO 9001 CE
    Price : negotiable price
    Supply Ability : 30set per month
    Delivery Time : 20 work days
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    FPC HDI 50um Laser Direct Imaging Equipment 610x710mm

    laser direct imaging (LDI) system solutions PCB Solder Mask


    Difference between LDI and traditional exposure

    1. Traditional exposure is to transfer the image to PCB by irradiating the negative with a mercury lamp

    2. LDI uses the laser scanning method to directly image the image on PCB, and the image is finer


    PCB laser direct imaging (LDI)
    When fabricating a circuit board, the circuit traces are defined by what is the imaging process. Laser direct imaging ( LDI ) exposes the traces directly with a highly focused laser beam that in NC controlled, instead of flooded light passing through a photo tool, a laser beam will digitally create the image.


    How does laser direct imaging ( LDI ) work?
    Laser direct imaging needs a PCB with the photo-sensitive surface that is positioned under a computer controlled laser. And then the computer is creating the image on the board with the light of laser. A computer scans the board surface into a raster image, matching the raster image to a pre-loaded CAD or CAM design file that includes the specifications for the necessary image intended for the board, the laser is used for directly creating the image on the board.


    Specification/modelDPX230
    ApplicationPCB,HDI,FPC (inner layer,outer layer,anti-welding)
    Resolution (mass production)30um
    Capacity30-40S@18"*24"
    Exposure Size610*710mm
    Panel thickness0.05mm-3.5mm
    Alignment ModeUV-Mark
    Alignment capabilityOuter layer±12um;Inner laye±24um
    Line width tolerance±10%
    Deviation increase and decrease modeFixed increase and contraction, automatic increase and contraction, interval increase and contraction, partition alignment
    Laser typeLD Laser,405±5nm
    File formatGerber 274X;ODB++
    Power380V three-phase alternating current, 6.4kW,50HZ, voltage fluctuation range + 7% ~-10%
    ConditionYellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above;
    Vibration requirements to avoid violent vibration near the equipment


    About us
    We are an innovative supplier of various PCB laser direct imaging (LDI) system solutions. Our system product portfolio ranges from LDI system configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.

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